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ICM-20600 InvenSense 6-axis motion tracking device
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ICM-20600 InvenSense 6-axis motion tracking device

ICM-20600 InvenSense 6-axis motion tracking device

ICM-20600 InvenSense 6-Axis Motion Tracking Device

Manufacturer: TDK

Product Type: IMU Inertial Measurement Unit

Installation style: SMD/SMT

Package/Box: LGA-14

Sensor type: 6-axis

Interface types: I2C, SPI

Output type: Digital

Acceleration: 2 g, 4 g, 8 g, 16 g

Resolution: 16 bits

Sensitivity: 16384 LSB/g

Minimum operating temperature: -40 ° C

Maximum operating temperature:+85 ° C

Power Supply Voltage - Minimum: 1.71 V

Power Supply Voltage - Maximum: 3.45 V

Working power supply current: 2.79 mA

Encapsulation: Reel

Encapsulation: Cut Tape

Package: MouseReel

Trademark: TDK InvenSense

Assembly country: Not Available

Spread country: Not Available

Country of Origin: TW, CN

Product Type: IMUs - Inertial Measurement Units

Sensing axis: X, Y, Z

5000 

Subcategory: Sensors

Trademark Name: SmartMotion

Unit weight: 546.533 mg

The ICM-20600 is a high-performance six axis inertial measurement unit (IMU) launched by TDK InvenSense, which integrates three-axis gyroscopes and three-axis accelerometers. With its high precision, low power consumption, and miniaturization characteristics, it is widely used in scenarios such as consumer electronics, industrial equipment, drones, and smart speakers that require high motion perception.

1、 Core performance parameters

Sensor type: 6-axis motion tracking device (3-axis gyroscope+3-axis accelerometer)

Package size: 2.5mm × 3mm × 0.91mm (14 pin LGA package), compact in size, suitable for high-density PCB layout

Working voltage: 1.71V to 3.45V, compatible with various low-power embedded system power supply designs

Communication interface: Supports dual interfaces of I ² C (up to 400kHz) and SPI (up to 10MHz) for easy integration with different main control chips

Gyroscope range: Programmable full-scale range of ± 250, ± 500, ± 1000, ± 2000 °/s, suitable for various dynamic motion detection needs

Range of accelerometer: Programmab

Noise performance:

Gyroscope noise: ± 4 mdps/√ Hz

Accelerometer noise: 100 μ g/√ Hz

Temperature sensor: Built in digital output temperature sensor, supports temperature compensation calibration

FIFO buffer: 1KB large capacity FIFO, supports entering low-power mode after sudden data read, reducing system processor load and overall power consumption

Working temperature range: -40 ° C to+85 ° C, meeting the environmental adaptability requirements of most industrial and consumer equipment

2、 Key technological advantages

High integration and miniaturization design

Integrating dual sensors and digital signal processing modules within a package of only 2.5 × 3mm significantly reduces peripheral circuit complexity and saves PCB space, making it suitable for space limited devices such as smart wearables, TWS earphones, and micro robots.

Low power operation mode, extending battery life

Normal mode: Typical power consumption of 1.8mA, fully functional operation

Low power mode: periodic wake-up sampling, power consumption as low as 20 μ A

Standby mode: The sensor is turned off, only the register state is maintained, and the power consumption is only 5 μ A

Supports multiple power consumption modes:

Combined with FIFO mechanism, the main controller can quickly sleep after batch reading data, achieving high efficiency and energy saving.

Support EIS FSYNC and motion wake-up interrupt

Built in EIS (Electronic Image Stabilization) FSYNC support, which can be used for frame synchronization of camera modules to enhance video stability.

Provide motion wake-up interrupt function, which can wake up the main control when device movement is detected, suitable for IoT nodes with "constant power but low power consumption".

Excellent noise control and stability

The sensitivity error of the gyroscope is only ± 1%, and with low noise performance, it ensures small drift and high accuracy in long-term attitude calculation.

Suitable for applications that require continuous angle accumulation, such as AR/VR headsets, drone flight control, etc.

Improve development support and accelerate product implementation

TDK provides dedicated evaluation kits (such as DK-20600) and software development kits (SDKs) that support rapid prototyping validation.

Compatible with mainstream embedded operating systems such as FreeRTOS, making it easy to build real-time data collection tasks.

3、 Typical application scenarios

Consumer Electronics:

Smartphones and tablets: achieve automatic screen rotation, shake control, and step counting functions

Smart speaker: Achieving "adaptive beamforming" through posture perception to improve voice pickup accuracy

Wearable devices: used for motion recognition, sleep monitoring, and fall alarm of fitness wristbands

Internet of Things and Smart Home:

Smart remote control, 3D mouse: supports aerial gesture interaction

Home security sensors: detect abnormal movement of doors and windows or falling devices

Industry and Automation:

Robot arm attitude feedback, AGV navigation stability monitoring

Vibration Analysis Unit in Structural Health Monitoring (SHM) System

Expansion in emerging fields:

Head Tracking in Virtual Reality (VR) and Augmented Reality (AR) Devices

IMU assisted positioning in autonomous driving assistance systems

4、 Hardware design suggestions and common problems

Signal integrity optimization

Suggest shortening the length of I ² C/SPI wiring to avoid high-frequency interference; Use differential distribution to reduce the impact of noise.

Connect 1 μ F and 0.1 μ F decoupling capacitors in parallel near the VDD pin to suppress the impact of power supply fluctuations on sampling accuracy.

Multi sensor synchronization scheme

Use external interrupt pins (such as FSYNC) or hardware clock inputs to achieve data synchronization between multiple IMUs or sensors, reducing time drift.

Data drift calibration method

Run automatic zero bias calibration in a stationary state (by configuring registers), or dynamically adjust it in conjunction with temperature compensation curves to enhance long-term stability.

Welding process requirements

LGA packaging is sensitive to the reflow soldering temperature curve and must strictly follow the manufacturer's recommended soldering specifications to prevent virtual soldering or thermal damage

ICM-20600.png

TDK InvenSense | Sensor | Gyroscope | TDK Agent | TDK Sensor

For technical and business consultation, 

please contact Engineer Zhang

WhatsApp:  86 13430464310 Email:ingfenzhang969@gmail.com


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