ICM-20600 InvenSense 6-Axis Motion Tracking Device
Manufacturer: TDK
Product Type: IMU Inertial Measurement Unit
Installation style: SMD/SMT
Package/Box: LGA-14
Sensor type: 6-axis
Interface types: I2C, SPI
Output type: Digital
Acceleration: 2 g, 4 g, 8 g, 16 g
Resolution: 16 bits
Sensitivity: 16384 LSB/g
Minimum operating temperature: -40 ° C
Maximum operating temperature:+85 ° C
Power Supply Voltage - Minimum: 1.71 V
Power Supply Voltage - Maximum: 3.45 V
Working power supply current: 2.79 mA
Encapsulation: Reel
Encapsulation: Cut Tape
Package: MouseReel
Trademark: TDK InvenSense
Assembly country: Not Available
Spread country: Not Available
Country of Origin: TW, CN
Product Type: IMUs - Inertial Measurement Units
Sensing axis: X, Y, Z
5000
Subcategory: Sensors
Trademark Name: SmartMotion
Unit weight: 546.533 mg
The ICM-20600 is a high-performance six axis inertial measurement unit (IMU) launched by TDK InvenSense, which integrates three-axis gyroscopes and three-axis accelerometers. With its high precision, low power consumption, and miniaturization characteristics, it is widely used in scenarios such as consumer electronics, industrial equipment, drones, and smart speakers that require high motion perception.
1、 Core performance parameters
Sensor type: 6-axis motion tracking device (3-axis gyroscope+3-axis accelerometer)
Package size: 2.5mm × 3mm × 0.91mm (14 pin LGA package), compact in size, suitable for high-density PCB layout
Working voltage: 1.71V to 3.45V, compatible with various low-power embedded system power supply designs
Communication interface: Supports dual interfaces of I ² C (up to 400kHz) and SPI (up to 10MHz) for easy integration with different main control chips
Gyroscope range: Programmable full-scale range of ± 250, ± 500, ± 1000, ± 2000 °/s, suitable for various dynamic motion detection needs
Range of accelerometer: Programmab
Noise performance:
Gyroscope noise: ± 4 mdps/√ Hz
Accelerometer noise: 100 μ g/√ Hz
Temperature sensor: Built in digital output temperature sensor, supports temperature compensation calibration
FIFO buffer: 1KB large capacity FIFO, supports entering low-power mode after sudden data read, reducing system processor load and overall power consumption
Working temperature range: -40 ° C to+85 ° C, meeting the environmental adaptability requirements of most industrial and consumer equipment
2、 Key technological advantages
High integration and miniaturization design
Integrating dual sensors and digital signal processing modules within a package of only 2.5 × 3mm significantly reduces peripheral circuit complexity and saves PCB space, making it suitable for space limited devices such as smart wearables, TWS earphones, and micro robots.
Low power operation mode, extending battery life
Normal mode: Typical power consumption of 1.8mA, fully functional operation
Low power mode: periodic wake-up sampling, power consumption as low as 20 μ A
Standby mode: The sensor is turned off, only the register state is maintained, and the power consumption is only 5 μ A
Supports multiple power consumption modes:
Combined with FIFO mechanism, the main controller can quickly sleep after batch reading data, achieving high efficiency and energy saving.
Support EIS FSYNC and motion wake-up interrupt
Built in EIS (Electronic Image Stabilization) FSYNC support, which can be used for frame synchronization of camera modules to enhance video stability.
Provide motion wake-up interrupt function, which can wake up the main control when device movement is detected, suitable for IoT nodes with "constant power but low power consumption".
Excellent noise control and stability
The sensitivity error of the gyroscope is only ± 1%, and with low noise performance, it ensures small drift and high accuracy in long-term attitude calculation.
Suitable for applications that require continuous angle accumulation, such as AR/VR headsets, drone flight control, etc.
Improve development support and accelerate product implementation
TDK provides dedicated evaluation kits (such as DK-20600) and software development kits (SDKs) that support rapid prototyping validation.
Compatible with mainstream embedded operating systems such as FreeRTOS, making it easy to build real-time data collection tasks.
3、 Typical application scenarios
Consumer Electronics:
Smartphones and tablets: achieve automatic screen rotation, shake control, and step counting functions
Smart speaker: Achieving "adaptive beamforming" through posture perception to improve voice pickup accuracy
Wearable devices: used for motion recognition, sleep monitoring, and fall alarm of fitness wristbands
Internet of Things and Smart Home:
Smart remote control, 3D mouse: supports aerial gesture interaction
Home security sensors: detect abnormal movement of doors and windows or falling devices
Industry and Automation:
Robot arm attitude feedback, AGV navigation stability monitoring
Vibration Analysis Unit in Structural Health Monitoring (SHM) System
Expansion in emerging fields:
Head Tracking in Virtual Reality (VR) and Augmented Reality (AR) Devices
IMU assisted positioning in autonomous driving assistance systems
4、 Hardware design suggestions and common problems
Signal integrity optimization
Suggest shortening the length of I ² C/SPI wiring to avoid high-frequency interference; Use differential distribution to reduce the impact of noise.
Connect 1 μ F and 0.1 μ F decoupling capacitors in parallel near the VDD pin to suppress the impact of power supply fluctuations on sampling accuracy.
Multi sensor synchronization scheme
Use external interrupt pins (such as FSYNC) or hardware clock inputs to achieve data synchronization between multiple IMUs or sensors, reducing time drift.
Data drift calibration method
Run automatic zero bias calibration in a stationary state (by configuring registers), or dynamically adjust it in conjunction with temperature compensation curves to enhance long-term stability.
Welding process requirements
LGA packaging is sensitive to the reflow soldering temperature curve and must strictly follow the manufacturer's recommended soldering specifications to prevent virtual soldering or thermal damage

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